Development of a “Thermal-Associated Pain Index” score using infrared-thermography for objective pain assessment

Piscataway, NJ / IEEE (2017) [Contribution to a book, Contribution to a conference proceedings]

Smarter technology for a healthier world : 39th Annual International Conference of the IEEE Engineering in Medicine and Biology Society : July 11-15, 2017, International Convention Center (ICC), Jeju Island, Korea / EMBC'17, Jeju, Korea ; IEEE, EMB, PubMed, MEDLINE, The Korean Society of Medical & Biological Engineering
Page(s): 3831-3834

Authors

Selected Authors

Czaplik, Michael
Hochhausen, Nadine Carmen
Dohmeier, Henriette
Barbosa Pereira, Carina
Rossaint, Rolf

Identifier